JL

John M. Lauffer

IBM: 72 patents #999 of 70,183Top 2%
ET Endicott Interconnect Technologies: 56 patents #2 of 87Top 3%
📍 Waverly, NY: #1 of 31 inventorsTop 4%
🗺 New York: #313 of 115,490 inventorsTop 1%
Overall (All Time): #8,444 of 4,157,543Top 1%
130
Patents All Time

Issued Patents All Time

Showing 51–75 of 130 patents

Patent #TitleCo-InventorsDate
7045897 Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same Frank D. Egitto, How T. Lin, Voya R. Markovich, David L. Thomas 2006-05-16
7025607 Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Rabindra N. Das, Voya R. Markovich, Mark D. Poliks 2006-04-11
6996903 Formation of multisegmented plated through holes Donald S. Farquhar, Robert M. Japp, Konstantinos I. Papathomas 2006-02-14
6995322 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same Benson Chan 2006-02-07
6986198 Method of forming printed circuit card Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, Roy H. Magnuson, Voya R. Markovich +5 more 2006-01-17
6964884 Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same Benson Chan 2005-11-15
6900392 Information handling system utilizing circuitized substrate James W. Fuller, Voya R. Markovich 2005-05-31
6894228 High performance dense wire for printed circuit board Donald O. Anstrom, Bruce J. Chamberlin, Voya R. Markovich, David L. Thomas 2005-05-17
6872894 Information handling system utilizing circuitized substrate James W. Fuller, Voya R. Markovich 2005-03-29
6832436 Method for forming a substructure of a multilayered laminate Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, Voya R. Markovich, Douglas O. Powell +2 more 2004-12-21
6830875 Forming a through hole in a photoimageable dielectric structure Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, Voya R. Markovich, Peter A. Moschak +2 more 2004-12-14
6830627 Copper cleaning compositions, processes and products derived therefrom Kathleen L. Covert, Peter A. Moschak 2004-12-14
6828514 High speed circuit board and method for fabrication Benson Chan, How T. Lin, Voya R. Markovich, David L. Thomas 2004-12-07
6815085 Printed circuit board capacitor structure and method Bernd Karl Appelt 2004-11-09
6809269 Circuitized substrate assembly and method of making same James W. Fuller, Voya R. Markovich 2004-10-26
6781064 Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, Voya R. Markovich, William J. Rudik +1 more 2004-08-24
6750405 Two signal one power plane circuit board Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, Roy H. Magnuson, Voya R. Markovich +5 more 2004-06-15
6740819 Printed wiring board Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, Voya R. Markovich, Thomas R. Miller 2004-05-25
6739046 Method for producing dendrite interconnect for planarization Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, James R. Wilcox 2004-05-25
6739027 Method for producing printed circuit board with embedded decoupling capacitance Konstantinos I. Papathomas 2004-05-25
6700078 Formation of multisegmented plated through holes Donald S. Farquhar, Robert M. Japp, Konstantinos I. Papathomas 2004-03-02
6689543 Laser ablatable material and its use John S. Kresge, David J. Russell 2004-02-10
6625857 Method of forming a capacitive element Bernd Karl Appelt 2003-09-30
6608757 Method for making a printed wiring board Anilkumar C. Bhatt, Ashwinkumar C. Bhatt, Subahu D. Desai, Voya R. Markovich, Thomas R. Miller 2003-08-19
6593534 Printed wiring board structure with z-axis interconnections Gerald W. Jones, Voya R. Markovich, Thomas R. Miller, James P. Paoletti, Konstantinos I. Papathomas +1 more 2003-07-15