Issued Patents All Time
Showing 101–125 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6215649 | Printed circuit board capacitor structure and method | Bernd Karl Appelt | 2001-04-10 |
| 6204456 | Filling open through holes in a multilayer board | Voya R. Markovich, Cheryl Palomaki, William E. Wilson | 2001-03-20 |
| 6204453 | Two signal one power plane circuit board | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, Roy H. Magnuson, Voya R. Markovich +5 more | 2001-03-20 |
| 6201194 | Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric | Roy H. Magnuson, Voya R. Markovich, John A. Welsh | 2001-03-13 |
| 6194024 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2001-02-27 |
| 6195264 | Laminate substrate having joining layer of photoimageable material | Heike Marcello, David J. Russell | 2001-02-27 |
| 6188305 | Transformer formed in conjunction with printed circuit board | Chi-Shih Chang, Michael J. Johnson, Craig N. Johnston | 2001-02-13 |
| 6156221 | Copper etching compositions, processes and products derived therefrom | Kathleen L. Covert, Peter A. Moschak | 2000-12-05 |
| 6134772 | Via fill compositions for direct attach of devices and methods of applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 2000-10-24 |
| 6114098 | Method of filling an aperture in a substrate | Bernd Karl Appelt, John S. Kresge, Kostas Papathomas | 2000-09-05 |
| 6080668 | Sequential build-up organic chip carrier and method of manufacture | David J. Russell | 2000-06-27 |
| 6030693 | Method for producing multi-layer circuit board and resulting article of manufacture | Christina M. Boyko, Ronnie Charles McHatton, Issa S. Mahmoud | 2000-02-29 |
| 6009619 | Process for manufacturing an electronic circuit card | — | 2000-01-04 |
| 5985760 | Method for manufacturing a high density electronic circuit assembly | Donald Herman Glatzel, David J. Russell | 1999-11-16 |
| 5981880 | Electronic device packages having glass free non conductive layers | Bernd Karl Appelt, Anilkumar C. Bhatt, James W. Fuller, Voya R. Markovich, William J. Rudik +1 more | 1999-11-09 |
| 5977642 | Dendrite interconnect for planarization and method for producing same | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, James R. Wilcox | 1999-11-02 |
| 5972053 | Capacitor formed within printed circuit board | Joseph G. Hoffarth, Issa S. Mahmoud | 1999-10-26 |
| 5867898 | Method of manufacture multilayer circuit package | David J. Russell, James Jens Hansen | 1999-02-09 |
| 5830374 | Method for producing multi-layer circuit board and resulting article of manufacture | Christina M. Boyko, Ronnie Charles McHatton, Issa S. Mahmoud | 1998-11-03 |
| 5811736 | Electronic circuit cards with solder-filled blind vias | Richard C. Senger | 1998-09-22 |
| 5796587 | Printed circut board with embedded decoupling capacitance and method for producing same | Konstantinos I. Papathomas | 1998-08-18 |
| 5766670 | Via fill compositions for direct attach of devices and methods for applying same | Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more | 1998-06-16 |
| 5745334 | Capacitor formed within printed circuit board | Joseph G. Hoffarth, Issa S. Mahmoud | 1998-04-28 |
| 5670750 | Electric circuit card having a donut shaped land | David J. Russell, James Jens Hansen | 1997-09-23 |
| 5665650 | Method for manufacturing a high density electronic circuit assembly | Donald Herman Glatzel, David J. Russell | 1997-09-09 |