JL

John M. Lauffer

IBM: 72 patents #999 of 70,183Top 2%
ET Endicott Interconnect Technologies: 56 patents #2 of 87Top 3%
📍 Waverly, NY: #1 of 31 inventorsTop 4%
🗺 New York: #313 of 115,490 inventorsTop 1%
Overall (All Time): #8,444 of 4,157,543Top 1%
130
Patents All Time

Issued Patents All Time

Showing 126–130 of 130 patents

Patent #TitleCo-InventorsDate
5571593 Via fill compositions for direct attach of devices and methods for applying same Roy Lynn Arldt, Christina M. Boyko, Burtran Joe Cayson, Richard Michael Kozlowski, Joseph Duane Kulesza +7 more 1996-11-05
5305186 Power carrier with selective thermal performance Bernd Karl Appelt, Irv Memis, Richard A. Schumacher 1994-04-19
5214250 Method of reworking circuit panels, and circuit panels reworked thereby Burtran Joe Cayson, John A. Covert, Steven A. Duncan, Issa S. Mahmoud, Richard A. Schumacher 1993-05-25
5189261 Electrical and/or thermal interconnections and methods for obtaining such Lawrence C. Alexander, Bernd Karl Appelt, David K. Balkin, James Jens Hansen, Joseph Hromek +5 more 1993-02-23
5027253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards Richard A. Schumacher 1991-06-25