Issued Patents All Time
Showing 76–100 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6574090 | Printed circuit board capacitor structure and method | Bernd Karl Appelt | 2003-06-03 |
| 6542379 | Circuitry with integrated passive components and method for producing | David J. Russell | 2003-04-01 |
| 6524352 | Method of making a parallel capacitor laminate | Sylvia Adae-Amoakoh, Michael D. Lowell, Voya R. Markovich, Joseph J. Sniezek | 2003-02-25 |
| 6519843 | Method of forming a chip carrier by joining a laminate layer and stiffener | Heike Marcello, David J. Russell | 2003-02-18 |
| 6521844 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Stephen Joseph Fuerniss, Gary Johansson, Ross W. Keesler, Voya R. Markovich, Peter A. Moschak +2 more | 2003-02-18 |
| 6521328 | Copper etching compositions and products derived therefrom | Kathleen L. Covert, Peter A. Moschak | 2003-02-18 |
| 6496356 | Multilayer capacitance structure and circuit board containing the same and method of forming the same | Robert M. Japp, Konstantinos I. Papathomas | 2002-12-17 |
| 6495772 | High performance dense wire for printed circuit board | Donald O. Anstrom, Bruce J. Chamberlin, Voya R. Markovich, David L. Thomas | 2002-12-17 |
| 6479093 | Composite laminate circuit structure and methods of interconnecting the same | Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas, William E. Wilson | 2002-11-12 |
| 6427323 | Method for producing conductor interconnect with dendrites | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, James R. Wilcox | 2002-08-06 |
| 6426470 | Formation of multisegmented plated through holes | Donald S. Farquhar, Robert M. Japp, Konstantinos I. Papathomas | 2002-07-30 |
| 6426466 | Peripheral power board structure | Bruce J. Chamberlin, James R. Stack | 2002-07-30 |
| 6423905 | Printed wiring board with improved plated through hole fatigue life | William L. Brodsky, Kevin Knadle, Douglas O. Powell, David J. Russell | 2002-07-23 |
| 6407341 | Conductive substructures of a multilayered laminate | Donald O. Anstrom, Bruce J. Chamberlin, James W. Fuller, Voya R. Markovich, Douglas O. Powell +2 more | 2002-06-18 |
| 6391210 | Process for manufacturing a multi-layer circuit board | Bernd Karl Appelt, Voya R. Markovich, Irving Memis, David J. Russell | 2002-05-21 |
| 6388204 | Composite laminate circuit structure and methods of interconnecting the same | Voya R. Markovich, Thomas R. Miller, Konstantinos I. Papathomas, William E. Wilson | 2002-05-14 |
| 6370012 | Capacitor laminate for use in printed circuit board and as an interconnector | Sylvia Adae-Amoakoh, Michael D. Lowell, Voya R. Markovich, Joseph J. Sniezek | 2002-04-09 |
| 6369334 | Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations | — | 2002-04-09 |
| 6361923 | Laser ablatable material and its use | John S. Kresge, David J. Russell | 2002-03-26 |
| 6343001 | Multilayer capacitance structure and circuit board containing the same | Robert M. Japp, Konstantinos I. Papathomas | 2002-01-29 |
| 6300575 | Conductor interconnect with dendrites through film | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, James R. Wilcox | 2001-10-09 |
| 6290860 | Process for design and manufacture of fine line circuits on planarized thin film dielectrics and circuits manufactured thereby | Bernd Karl Appelt, Voya R. Markovich, Irving Memis, David J. Russell | 2001-09-18 |
| 6256874 | Conductor interconnect with dendrites through film and method for producing same | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, James R. Wilcox | 2001-07-10 |
| 6256850 | Method for producing a circuit board with embedded decoupling capacitance | Konstantinos I. Papathomas | 2001-07-10 |
| 6252179 | Electronic package on metal carrier | Kostantinos Papathomas | 2001-06-26 |