Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
JL

John M. Lauffer — 130 Patents

IBM: 72 patents #1,005 of 70,183Top 2%
ETEndicott Interconnect Technologies: 56 patents #2 of 87Top 3%
Waverly, NY: #1 of 31 inventorsTop 4%
New York: #314 of 115,490 inventorsTop 1%
Overall (All Time): #8,439 of 4,157,543Top 1%
130 Patents All Time
John M. Lauffer has been granted 130 US patents while listed as an inventor at IBM. The first was granted in 1991 and the most recent in September 2016. John M. Lauffer ranks #8,439 of 4,157,543 US inventors in our database (top 0.20%). Patent records list John M. Lauffer in Waverly, NY, US.

Patents per Year

Patents granted per year, 1991 to 2016Bar chart with a peak of 14 patents in 2002.peak 141991: 1 patents19911993: 2 patents1994: 1 patents1996: 1 patents19961997: 2 patents1998: 5 patents1999: 5 patents19992000: 6 patents2001: 12 patents2002: 14 patents20022003: 9 patents2004: 13 patents2005: 4 patents20052006: 8 patents2007: 10 patents2008: 12 patents20082009: 6 patents2010: 7 patents2011: 3 patents20112012: 5 patents2013: 3 patents2016: 1 patents2016

Issued Patents All Time

Showing 26–50 of 130 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7449381 Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Rabindra N. Das, How T. Lin, Voya R. Markovich 2008-11-11
7442879 Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate Rabindra N. Das, Roy H. Magnuson, Voya R. Markovich 2008-10-28
7429510 Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Rabindra N. Das, How T. Lin, Voya R. Markovich 2008-09-30
7383629 Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof Voya R. Markovich, Michael Wozniak 2008-06-10
7384856 Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate Rabindra N. Das, Voya R. Markovich, James T. Matthews 2008-06-10
7381587 Method of making circuitized substrate Robert M. Japp, Voya R. Markovich, William E. Wilson 2008-06-03
7377033 Method of making circuitized substrate with split conductive layer and information handling system utilizing same James M. Larnerd, Voya R. Markovich 2008-05-27
7353590 Method of forming printed circuit card Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, Roy H. Magnuson, Voya R. Markovich +5 more 2008-04-08 $6,866,000
7348677 Method of providing printed circuit board with conductive holes and board resulting therefrom James M. Larnerd, Voya R. Markovich, Kostas Papathomas 2008-03-25
7343674 Method of making circuitized substrate assembly James W. Fuller, Voya R. Markovich 2008-03-18
7328502 Apparatus for making circuitized substrates in a continuous manner Voya R. Markovich, James W. Orband, William E. Wilson 2008-02-12
7326643 Method of making circuitized substrate with internal organic memory device Subahu D. Desai, How T. Lin, Voya R. Markovich, David L. Thomas 2008-02-05
7307022 Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof Frank D. Egitto, Stephen Krasniak, Voya R. Markovich, Luis J. Matienzo 2007-12-11
7293355 Apparatus and method for making circuitized substrates in a continuous manner Voya R. Markovich, James W. Orband, William E. Wilson 2007-11-13
7253502 Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same Subahu D. Desai, How T. Lin, Voya R. Markovich, David L. Thomas 2007-08-07
7235745 Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate Rabindra N. Das, Voya R. Markovich 2007-06-26
7211470 Method and apparatus for depositing conductive paste in circuitized substrate openings Norman A. Card 2007-05-01
7211289 Method of making multilayered printed circuit board with filled conductive holes James M. Larnerd, Voya R. Markovich, Kostas Papathomas 2007-05-01
7209368 Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making Voya R. Markovich, Corey Seastrand, David L. Thomas 2007-04-24
7176383 Printed circuit board with low cross-talk noise Voya R. Markovich, James J. McNamara, Jr., David L. Thomas 2007-02-13
7157646 Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same James M. Larnerd, Voya R. Markovich 2007-01-02
7157647 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same James M. Larnerd, Voya R. Markovich 2007-01-02
7152319 Method of making high speed circuit board Benson Chan, How T. Lin, Voya R. Markovich, David L. Thomas 2006-12-26
7071423 Circuitized substrate assembly and method of making same James W. Fuller, Voya R. Markovich 2006-07-04
7047630 Method of making circuitized substrate assembly James W. Fuller, Voya R. Markovich 2006-05-23