Issued Patents All Time
Showing 26–50 of 130 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449381 | Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate | Rabindra N. Das, How T. Lin, Voya R. Markovich | 2008-11-11 |
| 7442879 | Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate | Rabindra N. Das, Roy H. Magnuson, Voya R. Markovich | 2008-10-28 |
| 7429510 | Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate | Rabindra N. Das, How T. Lin, Voya R. Markovich | 2008-09-30 |
| 7383629 | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof | Voya R. Markovich, Michael Wozniak | 2008-06-10 |
| 7384856 | Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate | Rabindra N. Das, Voya R. Markovich, James T. Matthews | 2008-06-10 |
| 7381587 | Method of making circuitized substrate | Robert M. Japp, Voya R. Markovich, William E. Wilson | 2008-06-03 |
| 7377033 | Method of making circuitized substrate with split conductive layer and information handling system utilizing same | James M. Larnerd, Voya R. Markovich | 2008-05-27 |
| 7353590 | Method of forming printed circuit card | Kenneth Michael Fallon, Miguel A. Jimarez, Ross W. Keesler, Roy H. Magnuson, Voya R. Markovich +5 more | 2008-04-08 |
| 7348677 | Method of providing printed circuit board with conductive holes and board resulting therefrom | James M. Larnerd, Voya R. Markovich, Kostas Papathomas | 2008-03-25 |
| 7343674 | Method of making circuitized substrate assembly | James W. Fuller, Voya R. Markovich | 2008-03-18 |
| 7328502 | Apparatus for making circuitized substrates in a continuous manner | Voya R. Markovich, James W. Orband, William E. Wilson | 2008-02-12 |
| 7326643 | Method of making circuitized substrate with internal organic memory device | Subahu D. Desai, How T. Lin, Voya R. Markovich, David L. Thomas | 2008-02-05 |
| 7307022 | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof | Frank D. Egitto, Stephen Krasniak, Voya R. Markovich, Luis J. Matienzo | 2007-12-11 |
| 7293355 | Apparatus and method for making circuitized substrates in a continuous manner | Voya R. Markovich, James W. Orband, William E. Wilson | 2007-11-13 |
| 7253502 | Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same | Subahu D. Desai, How T. Lin, Voya R. Markovich, David L. Thomas | 2007-08-07 |
| 7235745 | Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate | Rabindra N. Das, Voya R. Markovich | 2007-06-26 |
| 7211470 | Method and apparatus for depositing conductive paste in circuitized substrate openings | Norman A. Card | 2007-05-01 |
| 7211289 | Method of making multilayered printed circuit board with filled conductive holes | James M. Larnerd, Voya R. Markovich, Kostas Papathomas | 2007-05-01 |
| 7209368 | Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making | Voya R. Markovich, Corey Seastrand, David L. Thomas | 2007-04-24 |
| 7176383 | Printed circuit board with low cross-talk noise | Voya R. Markovich, James J. McNamara, Jr., David L. Thomas | 2007-02-13 |
| 7157646 | Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same | James M. Larnerd, Voya R. Markovich | 2007-01-02 |
| 7157647 | Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same | James M. Larnerd, Voya R. Markovich | 2007-01-02 |
| 7152319 | Method of making high speed circuit board | Benson Chan, How T. Lin, Voya R. Markovich, David L. Thomas | 2006-12-26 |
| 7071423 | Circuitized substrate assembly and method of making same | James W. Fuller, Voya R. Markovich | 2006-07-04 |
| 7047630 | Method of making circuitized substrate assembly | James W. Fuller, Voya R. Markovich | 2006-05-23 |