Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9947581 | Method of forming a copper based interconnect structure | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2018-04-17 |
| 9947579 | Copper interconnect structure with manganese oxide barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2018-04-17 |
| 9934963 | Multilayer dielectric structures with graded composition for nano-scale semiconductor devices | Son V. Nguyen | 2018-04-03 |
| 9793193 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2017-10-17 |
| 9786760 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny | 2017-10-10 |
| 9754891 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Michael Rizzolo | 2017-09-05 |
| 9735005 | Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices | Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha | 2017-08-15 |
| 9711455 | Method of forming an air gap semiconductor structure with selective cap bilayer | Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Christopher J. Penny | 2017-07-18 |
| 9711456 | Composite manganese nitride/low-K dielectric cap | Donald F. Canaperi, Son V. Nguyen, Takeshi Nogami | 2017-07-18 |
| 9711507 | Separate N and P fin etching for reduced CMOS device leakage | Isabel Cristina Chu, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Mona A. Ebrish, Gauri Karve +3 more | 2017-07-18 |
| 9691705 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more | 2017-06-27 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9607825 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more | 2017-03-28 |
| 9601371 | Interconnect structure with barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2017-03-21 |
| 9558934 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more | 2017-01-31 |
| 9558935 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more | 2017-01-31 |
| 9536733 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more | 2017-01-03 |
| 9472503 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami +1 more | 2016-10-18 |
| 9455182 | Interconnect structure with capping layer and barrier layer | Daniel C. Edelstein, Son V. Nguyen, Takeshi Nogami, Hosadurga Shobha | 2016-09-27 |
| 9449810 | Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors | Donald F. Canaperi, Son V. Nguyen, Hosadurga Shobha | 2016-09-20 |
| 9449812 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Hosadurga Shobha +1 more | 2016-09-20 |
| 9435031 | Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same | Alfred Grill, Son V. Nguyen | 2016-09-06 |
| 9431235 | Multilayer dielectric structures with graded composition for nano-scale semiconductor devices | Son V. Nguyen | 2016-08-30 |
| 9412629 | Wafer bonding for 3D device packaging fabrication | Son V. Nguyen, Vamsi K. Paruchuri, Tuan A. Vo | 2016-08-09 |
| 9349687 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Stephen M. Gates, Elbert E. Huang, Joe Lee, Son V. Nguyen, Brown C. Peethala +1 more | 2016-05-24 |