Issued Patents All Time
Showing 101–125 of 365 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8404582 | Structure and method for manufacturing interconnect structures having self-aligned dielectric caps | Takeshi Nogami, Shom Ponoth, Chih-Chao Yang | 2013-03-26 |
| 8399350 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, Son V. Nguyen, Shom Ponoth, Chih-Chao Yang | 2013-03-19 |
| 8390079 | Sealed air gap for semiconductor chip | Elbert E. Huang, Charles W. Koburger, III, Douglas C. La Tulipe, Jr., Shom Ponoth | 2013-03-05 |
| 8383490 | Borderless contact for ultra-thin body devices | Su Chen Fan, Balasubramanian S. Haran | 2013-02-26 |
| 8368146 | FinFET devices | Veeraraghavan S. Basker, Hemanth Jagannathan, Charles W. Koburger, III | 2013-02-05 |
| 8354751 | Interconnect structure for electromigration enhancement | Shom Ponoth, Chih-Chao Yang | 2013-01-15 |
| 8354703 | Semiconductor capacitor | Shom Ponoth, Hosadurga Shobha, Chih-Chao Yang | 2013-01-15 |
| 8349674 | Forming borderless contact for transistors in a replacement metal gate process | Shom Ponoth, Charles W. Koburger, III, Chih-Chao Yang | 2013-01-08 |
| 8299625 | Borderless interconnect line structure self-aligned to upper and lower level contact vias | Shom Ponoth, Charles W. Koburger, III, Chih-Chao Yang | 2012-10-30 |
| 8300452 | Structure and method for improving storage latch susceptibility to single event upsets | Ethan H. Cannon, Toshiharu Furukawa, Charles W. Koburger, III, Jack A. Mandelman | 2012-10-30 |
| 8298954 | Sidewall image transfer process employing a cap material layer for a metal nitride layer | John C. Arnold, Sean D. Burns, Matthew E. Colburn, Yunpeng Yin | 2012-10-30 |
| 8288268 | Microelectronic structure including air gap | Daniel C. Edelstein, Elbert E. Huang, Satyanarayana V. Nitta, Takeshi Nogami, Shom Ponoth +1 more | 2012-10-16 |
| 8232618 | Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly approach | Gregory Breyta, Elbert E. Huang, Charles W. Koburger, III, Douglas C. La Tulipe, Jr., Shom Ponoth | 2012-07-31 |
| 8232204 | Method of forming borderless contact for transistor | Charles W. Koburger, III, Steven J. Holmes, Shom Ponoth, Chih-Chao Yang | 2012-07-31 |
| 8232179 | Method to improve wet etch budget in FEOL integration | Jason E. Cummings, Lisa F. Edge, Balasubramanian S. Haran, Hemanth Jagannathan, Sanjay C. Mehta | 2012-07-31 |
| 8227339 | Creation of vias and trenches with different depths | Shom Ponoth, Takeshi Nogami, Chih-Chao Yang | 2012-07-24 |
| 8211776 | Integrated circuit line with electromigration barriers | Takeshi Nogami, Shom Ponoth, Chih-Chao Yang | 2012-07-03 |
| 8202460 | Microelectronic substrate having removable edge extension element | Charles W. Koburger, III, Steven J. Holmes, Kurt R. Kimmel, Karen E. Petrillo, Christopher F. Robinson | 2012-06-19 |
| 8183159 | Device component forming method with a trim step prior to sidewall image transfer (SIT) processing | Toshiharu Furukawa, Charles W. Koburger, III, Qiqing C. Quyang | 2012-05-22 |
| 8138100 | Microelectronic structure by selective deposition | Toshiharu Furukawa, Steven J. Holmes, Charles W. Koburger, III | 2012-03-20 |
| 8124525 | Method of forming self-aligned local interconnect and structure formed thereby | Charles W. Koburger, III, Shom Pomoth, Chih-Chao Yang, Su Chen Fan, Sivananda K. Kanakasabapathy | 2012-02-28 |
| 8084311 | Method of forming replacement metal gate with borderless contact and structure thereof | Su Chen Fan, Theodorus E. Standaert | 2011-12-27 |
| 8039334 | Shared gate for conventional planar device and horizontal CNT | Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, Charles W. Koburger, III, Mark E. Masters | 2011-10-18 |
| 8030202 | Temporary etchable liner for forming air gap | Elbert E. Huang, Charles W. Koburger, III, Shom Ponoth | 2011-10-04 |
| 8021974 | Structure and method for back end of the line integration | Chih-Chao Yang, Takeshi Nogami, Shom Ponoth | 2011-09-20 |