Issued Patents All Time
Showing 51–75 of 365 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8906793 | Borderless contact for an aluminum-containing gate | Sivananda K. Kanakasabapathy, Hemanth Jagannathan | 2014-12-09 |
| 8906807 | Single fin cut employing angled processing methods | Marc A. Bergendahl, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-12-09 |
| 8901744 | Hybrid copper interconnect structure and method of fabricating same | Chih-Chao Yang, Charles W. Koburger, III, Shom Ponoth | 2014-12-02 |
| 8896067 | Method of forming finFET of variable channel width | Marc A. Bergendahl, Shom Ponoth, Chih-Chao Yang, Charles W. Koburger, III | 2014-11-25 |
| 8877645 | Integrated circuit structure having selectively formed metal cap | Chih-Chao Yang, Charles W. Koburger, III, Shom Ponoth | 2014-11-04 |
| 8877615 | Methods of manufacturing finFET devices | Veeraraghavan S. Basker, Hemanth Jagannathan, Charles W. Koburger, III | 2014-11-04 |
| 8871624 | Sealed air gap for semiconductor chip | Elbert E. Huang, Charles W. Koburger, III, Douglas C. La Tulipe, Jr., Shom Ponoth | 2014-10-28 |
| 8853076 | Self-aligned contacts | Su Chen Fan, Shom Ponoth, David L. Rath, Muthumanickam Sankarapandian | 2014-10-07 |
| 8847323 | finFET devices | Veeraraghavan S. Basker, Hemanth Jagannathan, Charles W. Koburger, III | 2014-09-30 |
| 8836031 | Electrical isolation structures for ultra-thin semiconductor-on-insulator devices | Balasubramanian S. Haran, Charles W. Koburger, III, Shom Ponoth | 2014-09-16 |
| 8835305 | Method of fabricating a profile control in interconnect structures | Chih-Chao Yang, Shyng-Tsong Chen, Samuel S. Choi, Steven J. Holmes, Charles W. Koburger, III +4 more | 2014-09-16 |
| 8828876 | Dual mandrel sidewall image transfer processes | Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-09-09 |
| 8828862 | Air-dielectric for subtractive etch line and via metallization | Elbert E. Huang, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-09-09 |
| 8803321 | Dual damascene dual alignment interconnect scheme | Steven J. Holmes, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-08-12 |
| 8802558 | Copper interconnect structures and methods of making same | Chih-Chao Yang, Marc A. Bergendahl, Baozhen Li, Shom Ponoth | 2014-08-12 |
| 8796783 | Borderless contact structure employing dual etch stop layers | Su Chen Fan, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-08-05 |
| 8785284 | FinFETs and fin isolation structures | Marc A. Bergendahl, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-07-22 |
| 8779515 | Semiconductor structure containing an aluminum-containing replacement gate electrode | Sivananda K. Kanakasabapathy, Hemanth Jagannathan | 2014-07-15 |
| 8772168 | Formation of the dielectric cap layer for a replacement gate structure | Ruilong Xie, Balasubramanian S. Pranatharthi Haran, Su Chen Fan | 2014-07-08 |
| 8765585 | Method of forming a borderless contact structure employing dual etch stop layers | Su Chen Fan, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-07-01 |
| 8754520 | Formation of air gap with protection of metal lines | Takeshi Nogami, Shyng-Tsong Chen, Son V. Nguyen, Shom Ponoth, Chih-Chao Yang | 2014-06-17 |
| 8754483 | Low-profile local interconnect and method of making the same | Shom Ponoth, Charles W. Koburger, III, Chih-Chao Yang | 2014-06-17 |
| 8741752 | Borderless contacts in semiconductor devices | Su Chen Fan, Sivananda K. Kanakasabapathy | 2014-06-03 |
| 8735279 | Air-dielectric for subtractive etch line and via metallization | Elbert E. Huang, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-05-27 |
| 8716127 | Metal alloy cap integration | Chih-Chao Yang, Marc A. Bergendahl, Steven J. Holmes, Charles W. Koburger, III, Shom Ponoth | 2014-05-06 |