AW

Andy Wei

Globalfoundries: 132 patents #8 of 4,424Top 1%
AM AMD: 61 patents #89 of 9,279Top 1%
IN Intel: 20 patents #2,022 of 30,777Top 7%
📍 Yamhill, OR: #1 of 29 inventorsTop 4%
🗺 Oregon: #50 of 28,073 inventorsTop 1%
Overall (All Time): #2,893 of 4,157,543Top 1%
213
Patents All Time

Issued Patents All Time

Showing 151–175 of 213 patents

Patent #TitleCo-InventorsDate
8274120 Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions Thorsten Kammler, Jan Hoentschel, Manfred Horstmann, Peter Javorka, Joe Bloomquist 2012-09-25
8241977 Short channel transistor with reduced length variation by using amorphous electrode material during implantation Thilo Scheiper, Sven Beyer 2012-08-14
8227266 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions Anthony Mowry, Casey Scott, Vassilios Papageorgiou, Markus Lenski, Andreas Gehring 2012-07-24
8183100 Transistor with embedded SI/GE material having enhanced across-substrate uniformity Robert Neil Mulfinger, Jan Hoentschel, Casey Scott 2012-05-22
8183101 Multiple gate transistor having fins with a length defined by the gate electrode Robert Neil Mulfinger, Jan Hoentschel, Andrew Waite 2012-05-22
8129236 Method for creating tensile strain by applying stress memorization techniques at close proximity to the gate electrode Andreas Gehring, Anthony Mowry 2012-03-06
8114746 Method for forming double gate and tri-gate transistors on a bulk substrate Robert Neil Mulfinger, Thilo Scheiper, Thorsten Kammler 2012-02-14
8093634 In situ formed drain and source regions in a silicon/germanium containing transistor device Anthony Mowry, Andreas Gehring, Casey Scott 2012-01-10
8071442 Transistor with embedded Si/Ge material having reduced offset to the channel region Stephan Kronholz, Markus Lenski, Andreas Ott 2011-12-06
8062952 Strain transformation in biaxially strained SOI substrates for performance enhancement of P-channel and N-channel transistors Jan Hoentschel, Stefan Flachowsky 2011-11-22
8053273 Shallow PN junction formed by in situ doping during selective growth of an embedded semiconductor alloy by a cyclic growth/etch deposition process Thorsten Kammler, Ina Ostermay 2011-11-08
8039342 Enhanced integrity of a high-K metal gate electrode structure by using a sacrificial spacer for cap removal Uwe Griebenow, Jan Hoentschel, Thilo Scheiper 2011-10-18
8039878 Transistor having a channel with tensile strain and oriented along a crystallographic orientation with increased charge carrier mobility Igor Peidous, Thorsten Kammler 2011-10-18
8030148 Structured strained substrate for forming strained transistors with reduced thickness of active layer Jan Hoentschel, Sven Beyer 2011-10-04
8026134 Recessed drain and source areas in combination with advanced silicide formation in transistors Uwe Griebenow, Jan Hoentschel, Thilo Scheiper 2011-09-27
8021942 Method of forming CMOS device having gate insulation layers of different type and thickness Andrew Waite, Martin Trentzsch, Johannes Groschopf, Gunter Grasshoff, Andreas Ott 2011-09-20
7999326 Tensile strain source using silicon/germanium in globally strained silicon Karla Romero, Manfred Horstmann 2011-08-16
7977180 Methods for fabricating stressed MOS devices Andrew Waite 2011-07-12
7943442 SOI device having a substrate diode with process tolerant configuration and method of forming the SOI device Andreas Gehring, Jan Hoentschel 2011-05-17
7939399 Semiconductor device having a strained semiconductor alloy concentration profile Anthony Mowry, Bernhard Trui, Maciej Wiatr, Andreas Gehring 2011-05-10
7906383 Stress transfer in an interlayer dielectric by providing a stressed dielectric layer above a stress-neutral dielectric material in a semiconductor device Ralf Richter, Manfred Horstmann, Joerg Hohage 2011-03-15
7897451 Method for creating tensile strain by selectively applying stress memorization techniques to NMOS transistors Maciej Wiatr, Casey Scott, Andreas Gehring, Peter Javorka 2011-03-01
7879667 Blocking pre-amorphization of a gate electrode of a transistor Anthony Mowry, Markus Lenski, Roman Boschke 2011-02-01
7863171 SOI transistor having a reduced body potential and a method of forming the same Jan Hoentschel, Joe Bloomquist, Manfred Horstmann 2011-01-04
7829421 SOI transistor having an embedded strain layer and a reduced floating body effect and a method for forming the same Thorsten Kammler, Jan Hoentschel, Manfred Horstmann 2010-11-09