Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8236105 | Apparatus for controlling gas flow in a semiconductor substrate processing chamber | Heeyeop Chae, Hamid Tavassoli, Yan Ye | 2012-08-07 |
| 8231799 | Plasma reactor apparatus with multiple gas injection zones having time-changing separate configurable gas compositions for each zone | Xiaoye Zhao, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2012-07-31 |
| 8221580 | Plasma reactor with wafer backside thermal loop, two-phase internal pedestal thermal loop and a control processor governing both loops | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns +5 more | 2012-07-17 |
| 8157951 | Capacitively coupled plasma reactor having very agile wafer temperature control | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns +1 more | 2012-04-17 |
| 8092638 | Capacitively coupled plasma reactor having a cooled/heated wafer support with uniform temperature distribution | Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas A. Buchberger, Jr., Douglas H. Burns +1 more | 2012-01-10 |
| 8092639 | Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns +5 more | 2012-01-10 |
| 8080479 | Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-20 |
| 8076247 | Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-12-13 |
| 8034180 | Method of cooling a wafer support at a uniform temperature in a capacitively coupled plasma reactor | Paul Brillhart, Richard Fovell, Douglas A. Buchberger, Jr., Douglas H. Burns, Daniel J. Hoffman | 2011-10-11 |
| 8021521 | Method for agile workpiece temperature control in a plasma reactor using a thermal model | Douglas A. Buchberger, Jr., Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas H. Burns +5 more | 2011-09-20 |
| 8012304 | Plasma reactor with a multiple zone thermal control feed forward control apparatus | Paul Brillhart, Richard Fovell, Hamid Tavassoli, Douglas A. Buchberger, Jr., Douglas H. Burns +1 more | 2011-09-06 |
| 7988872 | Method of operating a capacitively coupled plasma reactor with dual temperature control loops | Paul Brillhart, Richard Fovell, Douglas A. Buchberger, Jr., Douglas H. Burns, Daniel J. Hoffman +4 more | 2011-08-02 |
| 7988815 | Plasma reactor with reduced electrical skew using electrical bypass elements | Shahid Rauf, Kenneth S. Collins, Kartik Ramaswamy, Hiroji Hanawa, Andrew Nguyen +5 more | 2011-08-02 |
| 7972469 | Plasma processing apparatus | Hiroji Hanawa, Andrew Nguyen, Keiji Horioka, Kenneth S. Collins, Lawrence Wong +3 more | 2011-07-05 |
| 7972467 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Yan Ye, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2011-07-05 |
| 7968469 | Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-06-28 |
| 7884025 | Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-08 |
| 7879731 | Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources | Kenneth S. Collins, Hiroji Hanawa, Kartik Ramaswamy, Douglas A. Buchberger, Jr., Shahid Rauf +10 more | 2011-02-01 |
| 7846846 | Method of preventing etch profile bending and bowing in high aspect ratio openings by treating a polymer formed on the opening sidewalls | Kenny L. Doan, Stephan Wege, Subhash Deshmukh | 2010-12-07 |
| 7777599 | Methods and apparatus for controlling characteristics of a plasma | Steven C. Shannon, Daniel J. Hoffman, Matthew L. Miller, Olga Regelman, Kenneth S. Collins +1 more | 2010-08-17 |
| 7754997 | Apparatus and method to confine plasma and reduce flow resistance in a plasma | Yan Ye, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2010-07-13 |
| 7674353 | Apparatus to confine plasma and to enhance flow conductance | Daniel J. Hoffman, Yan Ye, Michael Kutney, Douglas A. Buchberger, Jr. | 2010-03-09 |
| 7618516 | Method and apparatus to confine plasma and to enhance flow conductance | Daniel J. Hoffman, Yan Ye, Michael Kutney, Douglas A. Buchberger, Jr. | 2009-11-17 |
| 7585384 | Apparatus and method to confine plasma and reduce flow resistance in a plasma reactor | Yan Ye, James D. Carducci, Daniel J. Hoffman, Steven C. Shannon, Douglas A. Buchberger, Jr. | 2009-09-08 |
| 7541292 | Plasma etch process with separately fed carbon-lean and carbon-rich polymerizing etch gases in independent inner and outer gas injection zones | Xiaoye Zhao, Kenny L. Doan, Ezra Robert Gold, Paul Brillhart, Bruno Geoffrion +2 more | 2009-06-02 |