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Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more |
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| 12412842 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia |
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| 12406893 |
Edge-aligned template structure for integrated circuit packages |
Omkar G. Karhade, Nitin A. Deshpande |
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| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
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Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge |
Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur |
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| 12347807 |
Inorganic fill material for stacked die assembly |
Mohammad Enamul Kabir |
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| 12347783 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
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| 12341281 |
Micro socket electrical couplings for dies |
Srikant Nekkanty, Joe Walczyk, Saikumar Jayaraman, Feroz Mohammad |
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| 12341129 |
Substrateless double-sided embedded multi-die interconnect bridge |
Biancun Xie, Jianyong Xie, Sujit Sharan, Robert L. Sankman |
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| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman |
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| 12283535 |
IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects |
Je-Young Chang, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad |
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| 12272650 |
Microelectronic package with substrate cavity for bridge-attach |
Omkar G. Karhade, Nitin A. Deshpande, Amruthavalli Pallavi Alur |
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| 12272656 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
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| 12243806 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
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| 12218040 |
Nested interposer with through-silicon via bridge die |
Srinivas V. Pietambaram, Kristof Darmawikarta, Ravindranath V. Mahajan, Rahul N. Manepalli |
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| 12205915 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Sergio Antonio Chan Arguedas, Jimin Yao, Chandra Mohan Jha |
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| 12199048 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-01-14 |