| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Jeremy Ecton, Omkar G. Karhade +5 more |
2025-09-23 |
| 12381029 |
Stepped coax MIL PTHS for modulating inductance within a package |
Brandon C. Marin, Krishna Bharath, Haifa Hariri |
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| 12362250 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2025-07-15 |
| 12345931 |
Optical circuit with optical port in sidewall |
Eric J. M. Moret, Srinivas V. Pietambaram |
2025-07-01 |
| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu +4 more |
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| 12334447 |
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) |
Kristof Darmawikarta, Siddharth K. Alur, Rahul Jain, Haobo Chen |
2025-06-17 |
| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more |
2025-06-17 |
| 12336197 |
In-plane inductors in IC packages |
Brandon C. Marin, Prithwish Chatterjee, Haifa Hariri, Yikang Deng, Sheng Li +1 more |
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| 12327797 |
Microelectronic structures including glass cores |
Srinivas V. Pietambaram, Gang Duan, Sai Vadlamani, Bharat P. Penmecha |
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| 12313890 |
Through-substrate optical vias |
Pooya Tadayon, Zhichao Zhang, Brandon C. Marin, Kemal Aygun, Stephen Andrew Smith |
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| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman |
2025-05-13 |
| 12272484 |
Coreless electronic substrates having embedded inductors |
Srinivas V. Pietambaram, Pooya Tadayon, Kristof Darmawikarta, Prithwish Chatterjee |
2025-04-08 |
| 12249584 |
Microelectronic assemblies having integrated magnetic core inductors |
Kristof Darmawikarta, Benjamin Duong, Srinivas V. Pietambaram |
2025-03-11 |
| 12230564 |
Package substrate z-disaggregation with liquid metal interconnects |
Brandon C. Marin, Karumbu Meyyappan, Valery Ouvarov-Bancalero, Dingying Xu |
2025-02-18 |