Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Nicholas S. Haehn, Ram Viswanath, Nicholas Neal, Mitul Modi | 2025-03-25 |