Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Tarek A. Ibrahim, Siddharth K. Alur, Haobo Chen | 2025-06-17 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12224264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2025-02-11 |