Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more | 2025-09-09 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Tarek A. Ibrahim, Siddharth K. Alur, Rahul Jain | 2025-06-17 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |