Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Omkar G. Karhade +5 more | 2025-09-23 |
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more | 2025-09-09 |
| 12394719 | Methods and apparatus to increase glass core thickness | Brandon C. Marin, Srinivas V. Pietambaram, Bai Nie | 2025-08-19 |
| 12353070 | Glass interposer optical switching device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Hari Mahalingam +1 more | 2025-07-08 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12306480 | Glass interposer optical resonator device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Rajeev Ranjan | 2025-05-20 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |
| 12255147 | Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein | Brandon C. Marin, Srinivas V. Pietambaram, Suddhasattwa Nad | 2025-03-18 |
| 12224103 | Angled inductor with small form factor | Brandon C. Marin, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram | 2025-02-11 |
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Oladeji Fadayomi, Oscar Ojeda | 2025-01-07 |