| 12422615 |
Nested glass packaging architecture for hybrid electrical and optical communication devices |
Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Omkar G. Karhade +5 more |
2025-09-23 |
| 12412868 |
Microelectronic assemblies including interconnects with different solder materials |
Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more |
2025-09-09 |
| 12394719 |
Methods and apparatus to increase glass core thickness |
Brandon C. Marin, Srinivas V. Pietambaram, Bai Nie |
2025-08-19 |
| 12353070 |
Glass interposer optical switching device and method |
Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Hari Mahalingam +1 more |
2025-07-08 |
| 12354883 |
Omni directional interconnect with magnetic fillers in mold matrix |
Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more |
2025-07-08 |
| 12306480 |
Glass interposer optical resonator device and method |
Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Rajeev Ranjan |
2025-05-20 |
| 12255130 |
Airgap structures for high speed signal integrity |
Hongxia Feng, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more |
2025-03-18 |
| 12255147 |
Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein |
Brandon C. Marin, Srinivas V. Pietambaram, Suddhasattwa Nad |
2025-03-18 |
| 12224103 |
Angled inductor with small form factor |
Brandon C. Marin, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram |
2025-02-11 |
| 12191161 |
Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors |
Oladeji Fadayomi, Oscar Ojeda |
2025-01-07 |