Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more | 2025-07-08 |
| 12341117 | Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates | Kyle McElhinny, Hongxia Feng, Xiaoying Guo, Steve Cho, Jung Kyu Han +4 more | 2025-06-24 |
| 12230563 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2025-02-18 |
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Valery Ouvarov-Bancalero | 2025-02-18 |