Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Dingying Xu | 2025-02-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Brandon C. Marin, Tarek A. Ibrahim, Karumbu Meyyappan, Dingying Xu | 2025-02-18 |