Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Debendra Mallik, Tarek A. Ibrahim, Jeremy Ecton, Omkar G. Karhade +5 more | 2025-09-23 |
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jeremy Ecton, Jason M. Gamba, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more | 2025-09-09 |
| 12394719 | Methods and apparatus to increase glass core thickness | Jeremy Ecton, Srinivas V. Pietambaram, Bai Nie | 2025-08-19 |
| 12381029 | Stepped coax MIL PTHS for modulating inductance within a package | Krishna Bharath, Haifa Hariri, Tarek A. Ibrahim | 2025-08-05 |
| 12368511 | Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages | Kaveh Hosseini, Conor O'Keeffe, Hiroki Tanaka | 2025-07-22 |
| 12353070 | Glass interposer optical switching device and method | Hiroki Tanaka, Kristof Darmawikarta, Srinivas V. Pietambaram, Jeremy Ecton, Hari Mahalingam +1 more | 2025-07-08 |
| 12336197 | In-plane inductors in IC packages | Tarek A. Ibrahim, Prithwish Chatterjee, Haifa Hariri, Yikang Deng, Sheng Li +1 more | 2025-06-17 |
| 12327814 | Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity | Sai Vadlamani, Omkar G. Karhade, Tolga Acikalin | 2025-06-10 |
| 12313890 | Through-substrate optical vias | Pooya Tadayon, Zhichao Zhang, Tarek A. Ibrahim, Kemal Aygun, Stephen Andrew Smith | 2025-05-27 |
| 12306480 | Glass interposer optical resonator device and method | Hiroki Tanaka, Kristof Darmawikarta, Srinivas V. Pietambaram, Jeremy Ecton, Rajeev Ranjan | 2025-05-20 |
| 12282174 | Converting multiple light signals into and out of a single wavelength with multiple polarizations to increase optical bandwidth | Kaveh Hosseini, Conor O'Keeffe, Hiroki Tanaka | 2025-04-22 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati | 2025-03-18 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Jeremy Ecton, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo +4 more | 2025-03-18 |
| 12255147 | Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein | Jeremy Ecton, Srinivas V. Pietambaram, Suddhasattwa Nad | 2025-03-18 |
| 12230564 | Package substrate z-disaggregation with liquid metal interconnects | Tarek A. Ibrahim, Karumbu Meyyappan, Valery Ouvarov-Bancalero, Dingying Xu | 2025-02-18 |
| 12224253 | Magnetic inductor device and method | Xin Ning, Kyu Oh Lee, Siddharth K. Alur, Numair Ahmed, Brent Williams +3 more | 2025-02-11 |
| 12224103 | Angled inductor with small form factor | Jeremy Ecton, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram | 2025-02-11 |