Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300613 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Kristof Darmawikarta | 2025-05-13 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Kristof Darmawikarta, Brandon C. Marin, Robert Alan May | 2025-03-18 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert Alan May | 2025-02-04 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |