Issued Patents 2025
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354931 | Optimization for raster scanning | Vinith BEJUGAM, Yonggang Li, Samuel T. George, Srinivas V. Pietambaram | 2025-07-08 |
| 12354963 | Lithographic cavity formation to enable EMIB bump pitch scaling | Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-07-08 |
| 12353070 | Glass interposer optical switching device and method | Hiroki Tanaka, Brandon C. Marin, Srinivas V. Pietambaram, Jeremy Ecton, Hari Mahalingam +1 more | 2025-07-08 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Srinivas V. Pietambaram, Hongxia Feng, Gang Duan +9 more | 2025-07-08 |
| 12345932 | Die last and waveguide last architecture for silicon photonic packaging | Bai Nie, Pooya Tadayon, Leonel Arana, Yonggang Li, Changhua Liu +4 more | 2025-07-01 |
| 12347788 | Glass substrates having signal shielding for use with semiconductor packages and related methods | Srinivas V. Pietambaram, Kemal Aygun, Telesphor Kamgaing, Zhiguo Qian, Jiwei Sun | 2025-07-01 |
| 12349282 | Capacitors in through glass vias | Benjamin Duong, Aleksandar Aleksov, Helme A. CASTRO DE LA TORRE, Darko Grujicic, Sashi S. Kandanur +5 more | 2025-07-01 |
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Tarek A. Ibrahim, Siddharth K. Alur, Rahul Jain, Haobo Chen | 2025-06-17 |
| 12334443 | Lithographic cavity formation to enable EMIB bump pitch scaling | Hiroki Tanaka, Robert Alan May, Sameer Paital, Bai Nie, Jesse C. Jones +1 more | 2025-06-17 |
| 12306480 | Glass interposer optical resonator device and method | Hiroki Tanaka, Brandon C. Marin, Srinivas V. Pietambaram, Jeremy Ecton, Rajeev Ranjan | 2025-05-20 |
| 12300613 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Robert Alan May, Sri Ranga Sai Boyapati | 2025-05-13 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2025-05-13 |
| 12272484 | Coreless electronic substrates having embedded inductors | Srinivas V. Pietambaram, Pooya Tadayon, Tarek A. Ibrahim, Prithwish Chatterjee | 2025-04-08 |
| 12253722 | Magneto-optical Kerr effect interconnects for photonic packaging | Hiroki Tanaka, Brandon C. Marin, Robert Alan May, Sri Ranga Sai Boyapati | 2025-03-18 |
| 12249584 | Microelectronic assemblies having integrated magnetic core inductors | Benjamin Duong, Srinivas V. Pietambaram, Tarek A. Ibrahim | 2025-03-11 |
| 12230430 | Substrate embedded magnetic core inductors and method of making | Srinivas V. Pietambaram, Gang Duan, Yonggang Li, Sameer Paital | 2025-02-18 |
| 12218040 | Nested interposer with through-silicon via bridge die | Srinivas V. Pietambaram, Debendra Mallik, Ravindranath V. Mahajan, Rahul N. Manepalli | 2025-02-04 |
| 12218071 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Javier Soto Gonzalez, Kwangmo Chris Lim | 2025-02-04 |
| 12218069 | Multi-chip package with high density interconnects | Aleksandar Aleksov, Adel A. Elsherbini, Robert Alan May, Sri Ranga Sai Boyapati | 2025-02-04 |