| 12413001 |
Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package |
Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Srikant Nekkanty +2 more |
2025-09-09 |
| 12411296 |
Reworkable zero-force insertion electrical optical package socket and method |
Eric J. M. Moret, Karumbu Meyyappan, Paul Diglio |
2025-09-09 |
| 12355002 |
Hyperchip |
Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly |
2025-07-08 |
| 12345932 |
Die last and waveguide last architecture for silicon photonic packaging |
Bai Nie, Leonel Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta +4 more |
2025-07-01 |
| 12349303 |
Low force liquid metal interconnect solutions |
Karumbu Meyyappan, Kyle Arrington, David Craig |
2025-07-01 |
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun |
2025-06-24 |
| 12313890 |
Through-substrate optical vias |
Zhichao Zhang, Brandon C. Marin, Tarek A. Ibrahim, Kemal Aygun, Stephen Andrew Smith |
2025-05-27 |
| 12298572 |
Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure |
Changhua Liu, Zhichao Zhang, Liang Zhang, Srikant Nekkanty |
2025-05-13 |
| 12272484 |
Coreless electronic substrates having embedded inductors |
Srinivas V. Pietambaram, Kristof Darmawikarta, Tarek A. Ibrahim, Prithwish Chatterjee |
2025-04-08 |
| 12230610 |
Double-sided substrate with cavities for direct die-to-die interconnect |
— |
2025-02-18 |
| 12213288 |
Self cooling adaptive flow branching heat exchanger system for cooling of one or more semiconductor chips |
Prabhakar Subrahmanyam, Arun Krishnamoorthy, Victor Polyanko, Ying-Feng PANG, Yi Xia +2 more |
2025-01-28 |