| 12432897 |
Cooling approaches for stitched dies |
Abhishek A. Sharma, Christopher M. Pelto, Mark C. Phillips, Swaminathan Sivakumar |
2025-09-30 |
| 12412835 |
Back-side power delivery with glass support at the front |
Abhishek A. Sharma, Telesphor Kamgaing |
2025-09-09 |
| 12406956 |
Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Abhishek A. Sharma, Van H. Le, Kimin Jun, Hui Jae Yoo |
2025-09-02 |
| 12400997 |
Hybrid manufacturing with modified via-last process |
Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly, Van H. Le |
2025-08-26 |
| 12396155 |
Backend memory with air gaps in upper metal layers |
Abhishek A. Sharma, Albert Chen, Fatih Hamzaoglu, Travis W. Lajoie, Van H. Le +3 more |
2025-08-19 |
| 12381193 |
Integrated circuit assemblies |
Abhishek A. Sharma, Van H. Le, Doug B. Ingerly |
2025-08-05 |
| 12355002 |
Hyperchip |
Mark Bohr, Rajesh Kumar, Pooya Tadayon, Doug B. Ingerly |
2025-07-08 |
| 12327809 |
Vertically stacked and bonded memory arrays |
Abhishek A. Sharma, Mauro J. Kobrinsky |
2025-06-10 |
| 12327581 |
Embedded memory IC's with power supply droop circuitry coupled to ferroelectric capacitors |
Abhishek A. Sharma, Uygar E. Avci |
2025-06-10 |
| 12310001 |
Decoupling capacitors and methods of fabrication |
Juan G. Alzate-Vinasco, Travis W. Lajoie, Fatih Hamzaoglu, Pulkit Jain, James Waldemer +4 more |
2025-05-20 |
| 12310032 |
Stacked backend memory with resistive switching devices |
Abhishek A. Sharma, Van H. Le, Hui Jae Yoo |
2025-05-20 |
| 12278229 |
Hybrid manufacturing for integrated circuit devices and assemblies |
Abhishek A. Sharma, Mauro J. Kobrinsky, Doug B. Ingerly |
2025-04-15 |
| 12271306 |
Integrated three-dimensional (3D) DRAM cache |
Adrian C. Moga, Abhishek A. Sharma |
2025-04-08 |
| 12197007 |
Multi-layered optical integrated circuit assembly with a monocrystalline waveguide and lower crystallinity bonding layer |
Abhishek A. Sharma |
2025-01-14 |