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Microelectronic assemblies having backside die-to-package interconnects |
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Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers |
Abhishek A. Sharma, Van H. Le, Wilfred Gomes, Hui Jae Yoo |
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Digitally controlled lithographically-defined multi-frequency acoustic resonators |
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Monolithic chip stacking using a die with double-sided interconnect layers |
Anup Pancholi |
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| 12300579 |
Liquid cooled interposer for integrated circuit stack |
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Backside contact structures and fabrication for metal on both sides of devices |
Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak |
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Self-aligned interconnect structures and methods of fabrication |
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Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
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Direct bonding in microelectronic assemblies |
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