Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417978 | Microelectronic assemblies having backside die-to-package interconnects | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan, Han Wui Then | 2025-09-16 |
| 12406956 | Bilayer memory stacking with computer logic circuits shared between bottom and top memory layers | Abhishek A. Sharma, Van H. Le, Wilfred Gomes, Hui Jae Yoo | 2025-09-02 |
| 12375060 | Digitally controlled lithographically-defined multi-frequency acoustic resonators | Ved Gund, Kevin P. O'Brien, Edris M. Mohammed, Arnab Sen Gupta, Matthew V. Metz +2 more | 2025-07-29 |
| 12362325 | Monolithic chip stacking using a die with double-sided interconnect layers | Anup Pancholi | 2025-07-15 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Feras Eid, Adel A. Elsherbini, Johanna M. Swan +1 more | 2025-05-13 |
| 12288810 | Backside contact structures and fabrication for metal on both sides of devices | Patrick Morrow, Rishabh Mehandru, Aaron D. Lilak | 2025-04-29 |
| 12266570 | Self-aligned interconnect structures and methods of fabrication | Souvik Ghosh, Willy Rachmady, Ashish Agrawal, Siddharth Chouksey, Jessica M. Torres +5 more | 2025-04-01 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Shawna M. Liff +3 more | 2025-04-01 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Aleksandar Aleksov, Mohammad Enamul Kabir +3 more | 2025-01-14 |