| 12505065 |
On-package die-to-die (D2D) interconnect for memory using universal chiplet interconnect express (UCIe) PHY |
Debendra Das Sharma, Narasimha Lanka, Peter Z. Onufryk, Swadesh Choudhary, Zuoguo Wu +2 more |
2025-12-23 |
| 12499019 |
Retimers to extend a die-to-die interconnect |
Debendra Das Sharma, Swadesh Choudhary, Sridhar Muthrasanallur, Narasimha Lanka, Zuoguo Wu +1 more |
2025-12-16 |
| 12499074 |
Die-to-die interconnect protocol layer |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmi Narasimhan Seshan, Zuoguo Wu |
2025-12-16 |
| 12500583 |
Clock interpolation system for eye-centering |
Jayen Desai, Pengyin WANG, Debendra Das Sharma |
2025-12-16 |
| 12481614 |
Standard interfaces for die to die (D2D) interconnect stacks |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Zuoguo Wu, Lakshmi Narasimhan Seshan |
2025-11-25 |
| 12469820 |
Fine-grained disaggregated server architecture |
Carleton L. Molnar, Adel A. Elsherbini, Tanay Karnik, Shawna M. Liff, Robert J. Munoz +6 more |
2025-11-11 |
| 12468597 |
Valid signal for latency sensitive die-to-die (D2D) interconnects |
Narasimha Lanka, Debendra Das Sharma, Lakshmi Narasimhan Seshan, Swadesh Choudhary, Zuoguo Wu |
2025-11-11 |
| 12405912 |
Link initialization training and bring up for die-to-die interconnect |
Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Zuoguo Wu |
2025-09-02 |
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more |
2025-09-02 |
| 12362306 |
Clock-gating in die-to-die (D2D) interconnects |
Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Swadesh Choudhary |
2025-07-15 |
| 12362284 |
Composite interposer structure and method of providing same |
Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan |
2025-07-15 |
| 12353305 |
Compliance and debug testing of a die-to-die interconnect |
Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu |
2025-07-08 |
| 12332826 |
Die-to-die interconnect |
Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu |
2025-06-17 |
| 12321305 |
Sideband interface for die-to-die interconnects |
Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu |
2025-06-03 |
| 12316343 |
PHY-based retry techniques for die-to-die interfaces |
Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Zuoguo Wu |
2025-05-27 |
| 12315794 |
Skip level vias in metallization layers for integrated circuit devices |
Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj |
2025-05-27 |
| 12306216 |
Dynamic voltage regulator sensing for chiplet-based designs |
Vikrant Thigle, Vijay Anand Mathiyalagan, Anand Haridass, Arun Chandrasekhar |
2025-05-20 |
| 12288746 |
Skip level vias in metallization layers for integrated circuit devices |
Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj |
2025-04-29 |
| 12266682 |
Capacitors and resistors at direct bonding interfaces in microelectronic assemblies |
Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Kimin Jun, Shawna M. Liff +3 more |
2025-04-01 |
