Issued Patents 2025
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406962 | Power delivery through capacitor-dies in a multi-layered microelectronic assembly | Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more | 2025-09-02 |
| 12405912 | Link initialization training and bring up for die-to-die interconnect | Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Zuoguo Wu | 2025-09-02 |
| 12362284 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Liff, Johanna M. Swan | 2025-07-15 |
| 12362306 | Clock-gating in die-to-die (D2D) interconnects | Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu, Swadesh Choudhary | 2025-07-15 |
| 12353305 | Compliance and debug testing of a die-to-die interconnect | Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu | 2025-07-08 |
| 12332826 | Die-to-die interconnect | Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Zuoguo Wu | 2025-06-17 |
| 12321305 | Sideband interface for die-to-die interconnects | Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Zuoguo Wu | 2025-06-03 |
| 12316343 | PHY-based retry techniques for die-to-die interfaces | Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Zuoguo Wu | 2025-05-27 |
| 12315794 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj | 2025-05-27 |
| 12306216 | Dynamic voltage regulator sensing for chiplet-based designs | Vikrant Thigle, Vijay Anand Mathiyalagan, Anand Haridass, Arun Chandrasekhar | 2025-05-20 |
| 12288746 | Skip level vias in metallization layers for integrated circuit devices | Adel A. Elsherbini, Mauro J. Kobrinsky, Shawna M. Liff, Johanna M. Swan, Sathya Narasimman Tiagaraj | 2025-04-29 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Kimin Jun, Shawna M. Liff +3 more | 2025-04-01 |