Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12405912 | Link initialization training and bring up for die-to-die interconnect | Narasimha Lanka, Lakshmipriya Seshan, Swadesh Choudhary, Debendra Das Sharma, Gerald Pasdast | 2025-09-02 |
| 12386768 | Extending multichip package link off package | Debendra Das Sharma, Mahesh Wagh, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2025-08-12 |
| 12372574 | Skew detection and compensation for high speed I/O links | Jong-Ru Guo, Jingbo Li, Xiaoning Ye, Howard L. Heck | 2025-07-29 |
| 12362306 | Clock-gating in die-to-die (D2D) interconnects | Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast, Swadesh Choudhary | 2025-07-15 |
| 12353305 | Compliance and debug testing of a die-to-die interconnect | Swadesh Choudhary, Narasimha Lanka, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast | 2025-07-08 |
| 12332826 | Die-to-die interconnect | Debendra Das Sharma, Swadesh Choudhary, Narasimha Lanka, Lakshmipriya Seshan, Gerald Pasdast | 2025-06-17 |
| 12321305 | Sideband interface for die-to-die interconnects | Narasimha Lanka, Swadesh Choudhary, Debendra Das Sharma, Lakshmipriya Seshan, Gerald Pasdast | 2025-06-03 |
| 12316343 | PHY-based retry techniques for die-to-die interfaces | Narasimha Lanka, Lakshmipriya Seshan, Debendra Das Sharma, Gerald Pasdast | 2025-05-27 |
| 12283994 | Apparatus, method, and system for performing error correction based on laser power setting | Ling Liao, David Chak Wang Hui | 2025-04-22 |
| 12196807 | Near field wireless communication system for mother to package and package to package sideband digital communication | Zhen Zhou, Renzhi Liu, Jong-Ru Guo, Kenneth P. Foust, Jason A. Mix +2 more | 2025-01-14 |