Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12386768 | Extending multichip package link off package | Debendra Das Sharma, Zuoguo Wu, Mohiuddin M. Mazumder, Venkatraman Iyer, Jeff C. Morriss | 2025-08-12 |
| 12373255 | Systems and methods for sharing memory across clusters of directly connected nodes | Alexander J. Branover, Francisco L. Duran, Vydhyanathan Kalyanasundharam | 2025-07-29 |
| 12222881 | Logical physical layer interface specification support for PCie 6.0, cxl 3.0, and UPI 3.0 protocols | Swadesh Choudhary, Debendra Das Sharma | 2025-02-11 |