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Computing system with cooling for controlling temperature of electronic components |
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Magnetic core inductors on package substrates |
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Packaging architecture for disaggregated integrated voltage regulators |
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| 12288750 |
Conformal power delivery structure for direct chip attach architectures |
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Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures |
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Magnetic core inductors in interposer |
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Direct bonding in microelectronic assemblies |
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