| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Telesphor Kamgaing |
2025-09-23 |
| 12424563 |
Disaggregated entropy services for microelectronic assemblies |
Rachael Parker, David Johnston |
2025-09-23 |
| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Telesphor Kamgaing, Neelam Prabhu Gaunkar, Veronica Strong, Aleksandar Aleksov |
2025-09-23 |
| 12406962 |
Power delivery through capacitor-dies in a multi-layered microelectronic assembly |
Adel A. Elsherbini, William J. Lambert, Krishna Bharath, Shawna M. Liff, Nicolas Butzen +4 more |
2025-09-02 |
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Aleksandar Aleksov, Telesphor Kamgaing, Veronica Strong, Neelam Prabhu Gaunkar |
2025-07-22 |
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Telesphor Kamgaing, Veronica Strong, Johanna M. Swan |
2025-07-01 |
| 12341114 |
Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling |
Qiang Yu, Adel A. Elsherbini, Shawna M. Liff |
2025-06-24 |
| 12327795 |
Waveguide interconnect bridges |
Johanna M. Swan |
2025-06-10 |
| 12300579 |
Liquid cooled interposer for integrated circuit stack |
Qiang Yu, Feras Eid, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more |
2025-05-13 |
| 12266840 |
Waveguide interconnects for semiconductor packages and related methods |
Johanna M. Swan, Adel A. Elsherbini, Shawna M. Liff, Beomseok Choi, Qiang Yu |
2025-04-01 |
| 12261097 |
Thermal management in integrated circuit packages |
Feras Eid, Telesphor Kamgaing, Aleksandar Aleksov, Johanna M. Swan |
2025-03-25 |
| 12255158 |
Components for millimeter-wave communication |
Neelam Prabhu Gaunkar, Telesphor Kamgaing, Diego Correas-Serrano, Henning Braunisch |
2025-03-18 |
| 12199012 |
Modular microchannel thermal solutions for integrated circuit devices |
Adel A. Elsherbini, Stephen L. Morein, Feras Eid |
2025-01-14 |