Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341114 | Microelectronic assemblies having a hybrid bonded interposer for die-to-die fan-out scaling | Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff | 2025-06-24 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Feras Eid, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more | 2025-05-13 |
| 12266840 | Waveguide interconnects for semiconductor packages and related methods | Georgios Dogiamis, Johanna M. Swan, Adel A. Elsherbini, Shawna M. Liff, Beomseok Choi | 2025-04-01 |