{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "2025", "item": "https://www.patentleaderboard.com/2025/"}, {"@type": "ListItem", "position": 3, "name": "Intel", "item": "https://www.patentleaderboard.com/2025/company/intel"}, {"@type": "ListItem", "position": 4, "name": "Feras Eid", "item": "https://www.patentleaderboard.com/2025/inventor/fl:fe_ln:eid-1"}]}

Home › 2025 › Intel › Feras Eid

FE

Feras Eid — 14 Patents in 2025

Intel: 14 patents #65 of 3,896Top 2%

Chandler, AZ: #14 of 487 inventorsTop 3%

Arizona: #37 of 3,383 inventorsTop 2%

Overall (2025): #3,868 of 469,880Top 1%

14 Patents 2025

Issued Patents 2025

Showing 1–14 of 14 patents

Patent #	Title	Co-Inventors	Date
12489032	Cooling of conformal power delivery structures	Aleksandar Aleksov, Henning Braunisch, Adel A. Elsherbini, Thomas L. Sounart, Johanna M. Swan	2025-12-02
12482779	Hybrid backside thermal structures for enhanced ic packages	Joe Walczyk, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala	2025-11-25
12456702	Device, method and system to mitigate stress on hybrid bonds in a multi-tier arrangement of chiplets	Kimin Jun, Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan +1 more	2025-10-28
12438087	High throughput additive manufacturing for integrated circuit components containing traces with feature size and grain boundaries	Adel A. Elsherbini, Aleksandar Aleksov, Weiyi Li, Stephen L. Morein, Yoshihiro Tomita	2025-10-07
12431430	Technologies for high throughput additive manufacturing for integrated circuit components	Yoshihiro Tomita, Aleksandar Aleksov, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein	2025-09-30
12381182	Direct bonding in microelectronic assemblies	Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan	2025-08-05
12374626	Architectures and methods of fabricating 3D stacked packages	Vijay K. Nair, Thomas L. Sounart	2025-07-29
12327775	Thermal performance in hybrid bonded 3D die stacks	Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot	2025-06-10
12300579	Liquid cooled interposer for integrated circuit stack	Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more	2025-05-13
12266682	Capacitors and resistors at direct bonding interfaces in microelectronic assemblies	Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more	2025-04-01
12261097	Thermal management in integrated circuit packages	Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan	2025-03-25
12242290	Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures	Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more	2025-03-04
12199012	Modular microchannel thermal solutions for integrated circuit devices	Adel A. Elsherbini, Stephen L. Morein, Georgios Dogiamis	2025-01-14
12199018	Direct bonding in microelectronic assemblies	Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more	2025-01-14