Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431430 | Technologies for high throughput additive manufacturing for integrated circuit components | Yoshihiro Tomita, Aleksandar Aleksov, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein | 2025-09-30 |
| 12381182 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan | 2025-08-05 |
| 12374626 | Architectures and methods of fabricating 3D stacked packages | Vijay K. Nair, Thomas L. Sounart | 2025-07-29 |
| 12327775 | Thermal performance in hybrid bonded 3D die stacks | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Aleksandar Aleksov, Julien Sebot | 2025-06-10 |
| 12300579 | Liquid cooled interposer for integrated circuit stack | Georgios Dogiamis, Qiang Yu, Adel A. Elsherbini, Kimin Jun, Johanna M. Swan +1 more | 2025-05-13 |
| 12266682 | Capacitors and resistors at direct bonding interfaces in microelectronic assemblies | Adel A. Elsherbini, Mohammad Enamul Kabir, Zhiguo Qian, Gerald Pasdast, Kimin Jun +3 more | 2025-04-01 |
| 12261097 | Thermal management in integrated circuit packages | Telesphor Kamgaing, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan | 2025-03-25 |
| 12242290 | Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures | Beomseok Choi, William J. Lambert, Krishna Bharath, Kaladhar Radhakrishnan, Adel A. Elsherbini +3 more | 2025-03-04 |
| 12199018 | Direct bonding in microelectronic assemblies | Adel A. Elsherbini, Krishna Bharath, Han Wui Then, Kimin Jun, Aleksandar Aleksov +3 more | 2025-01-14 |
| 12199012 | Modular microchannel thermal solutions for integrated circuit devices | Adel A. Elsherbini, Stephen L. Morein, Georgios Dogiamis | 2025-01-14 |