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Telesphor Kamgaing — 15 Patents in 2025

Intel: 15 patents #56 of 3,896Top 2%

Chandler, AZ: #13 of 487 inventorsTop 3%

Arizona: #36 of 3,383 inventorsTop 2%

Overall (2025): #3,369 of 469,880Top 1%

15 Patents 2025

Issued Patents 2025

Showing 1–15 of 15 patents

Patent #	Title	Co-Inventors	Date
12512396	Flexible die to floor planning with bump pitch scale through glass core via pitch	Andrew Collins, Srinivas V. Pietambaram, Tarek A. Ibrahim, Aleksandar Aleksov	2025-12-30
12489189	Contactless communication using a waveguide extending through a substrate core	Neelam Prabhu Gaunkar, Georgios Dogiamis, Johanna M. Swan	2025-12-02
12444619	Physical vapor deposition seeding for high aspect ratio vias in glass core technology	Veronica Strong, Aleksandar Aleksov, Georgios Dogiamis, Neelam Prabhu Gaunkar	2025-10-14
12424719	Compact surface transmission line waveguides with vertical ground planes	Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Aleksandar Aleksov	2025-09-23
12424716	RF filters and multiplexers manufactured in the core of a package substrate using glass core technology	Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Georgios Dogiamis	2025-09-23
12412835	Back-side power delivery with glass support at the front	Abhishek A. Sharma, Wilfred Gomes	2025-09-09
12400934	Dielectric film coating for through glass vias and plane surface roughness mitigation	Veronica Strong, Robert Jordan	2025-08-26
12368091	Package substrate with glass core having vertical power planes for improved power delivery	Aleksandar Aleksov, Veronica Strong, Georgios Dogiamis, Neelam Prabhu Gaunkar	2025-07-22
12362297	Semiconductor packages with antennas	Adel A. Elsherbini, Sasha N. Oster	2025-07-15
12347788	Glass substrates having signal shielding for use with semiconductor packages and related methods	Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Zhiguo Qian, Jiwei Sun	2025-07-01
12347761	Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate	Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Johanna M. Swan	2025-07-01
12327794	Die coupling using a substrate with a glass core	Johanna M. Swan	2025-06-10
12261097	Thermal management in integrated circuit packages	Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan	2025-03-25
12255158	Components for millimeter-wave communication	Neelam Prabhu Gaunkar, Georgios Dogiamis, Diego Correas-Serrano, Henning Braunisch	2025-03-18
12205908	Die to die high-speed communication without discrete amplifiers between a mixer and transmission line	—	2025-01-21