| 12424719 |
Compact surface transmission line waveguides with vertical ground planes |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Aleksandar Aleksov |
2025-09-23 |
| 12424716 |
RF filters and multiplexers manufactured in the core of a package substrate using glass core technology |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Veronica Strong, Georgios Dogiamis |
2025-09-23 |
| 12412835 |
Back-side power delivery with glass support at the front |
Abhishek A. Sharma, Wilfred Gomes |
2025-09-09 |
| 12400934 |
Dielectric film coating for through glass vias and plane surface roughness mitigation |
Veronica Strong, Robert Jordan |
2025-08-26 |
| 12368091 |
Package substrate with glass core having vertical power planes for improved power delivery |
Aleksandar Aleksov, Veronica Strong, Georgios Dogiamis, Neelam Prabhu Gaunkar |
2025-07-22 |
| 12362297 |
Semiconductor packages with antennas |
Adel A. Elsherbini, Sasha N. Oster |
2025-07-15 |
| 12347788 |
Glass substrates having signal shielding for use with semiconductor packages and related methods |
Kristof Darmawikarta, Srinivas V. Pietambaram, Kemal Aygun, Zhiguo Qian, Jiwei Sun |
2025-07-01 |
| 12347761 |
Magnetic planar spiral and high aspect ratio inductors for power delivery in the glass-core of a package substrate |
Aleksandar Aleksov, Neelam Prabhu Gaunkar, Georgios Dogiamis, Veronica Strong, Johanna M. Swan |
2025-07-01 |
| 12327794 |
Die coupling using a substrate with a glass core |
Johanna M. Swan |
2025-06-10 |
| 12261097 |
Thermal management in integrated circuit packages |
Feras Eid, Georgios Dogiamis, Aleksandar Aleksov, Johanna M. Swan |
2025-03-25 |
| 12255158 |
Components for millimeter-wave communication |
Neelam Prabhu Gaunkar, Georgios Dogiamis, Diego Correas-Serrano, Henning Braunisch |
2025-03-18 |
| 12205908 |
Die to die high-speed communication without discrete amplifiers between a mixer and transmission line |
— |
2025-01-21 |