Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388019 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2025-08-12 |
| 12347780 | Integrated circuit package with flipped high bandwidth memory device | Krishna Vasanth Valavala, Chandra Mohan Jha, Omkar G. Karhade | 2025-07-01 |
| 12205924 | Semiconductor packages with chiplets coupled to a memory device | Jianyong Xie | 2025-01-21 |