Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347780 | Integrated circuit package with flipped high bandwidth memory device | Krishna Vasanth Valavala, Andrew Collins, Omkar G. Karhade | 2025-07-01 |
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Weihua Tang, Robert L. Sankman, Xavier Francois Brun, Pooya Tadayon | 2025-06-24 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Sergio Antonio Chan Arguedas, Jimin Yao | 2025-01-21 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu | 2025-01-07 |