Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283535 | IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects | Debendra Mallik, Ram Viswanath, Elah Bozorg-Grayeli, Ahmad Al Mohammad | 2025-04-22 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu | 2025-01-07 |