Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308299 | TEC-embedded dummy die to cool the bottom die edge hotspot | Chia-Pin Chiu, Peng Li, Deepak Goyal | 2025-05-20 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2025-04-01 |
| 12205793 | Method and apparatus for anisotropic pattern etching and treatment | Seokmin Yun, Shuogang Huang, Mark Merrill | 2025-01-21 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Chandra Mohan Jha, Je-Young Chang, Chia-Pin Chiu | 2025-01-07 |