Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12349303 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, David Craig, Pooya Tadayon | 2025-07-01 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |