Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266589 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266589 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2025-04-01 |