Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366713 | Heat dissipation structures for optical communication devices | Omkar G. Karhade, Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan | 2025-07-22 |
| 12327807 | High density substrate routing in package | Weng Hong Teh | 2025-06-10 |
| 12308299 | TEC-embedded dummy die to cool the bottom die edge hotspot | Zhimin Wan, Peng Li, Deepak Goyal | 2025-05-20 |
| 12293956 | Boiling enhancement structures for immersion cooled electronic systems | Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more | 2025-05-06 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Zhimin Wan, Chandra Mohan Jha, Je-Young Chang | 2025-01-07 |