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Nested glass packaging architecture for hybrid electrical and optical communication devices |
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Microelectronic assemblies including interconnects with different solder materials |
Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun +6 more |
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| 12412842 |
Microelectronic structures including bridges |
Nitin A. Deshpande, Mohit Bhatia, Debendra Mallik |
2025-09-09 |
| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more |
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| 12406893 |
Edge-aligned template structure for integrated circuit packages |
Debendra Mallik, Nitin A. Deshpande |
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| 12399334 |
Photonic integrated circuit packaging architectures |
Xiaoqian Li, Nitin A. Deshpande |
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| 12392970 |
Photonic integrated circuit packaging architectures |
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| 12386127 |
Micro-lens array optically coupled with a photonics die |
Xiaoqian Li, Nitin A. Deshpande |
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| 12366713 |
Heat dissipation structures for optical communication devices |
Tolga Acikalin, Sushrutha Gujjula, Kelly Lofgreen, Ravindranath V. Mahajan, Chia-Pin Chiu |
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| 12347780 |
Integrated circuit package with flipped high bandwidth memory device |
Krishna Vasanth Valavala, Chandra Mohan Jha, Andrew Collins |
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| 12334472 |
Multiple wafer stack architecture to enable singulation |
Sairam Agraharam |
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| 12327814 |
Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavity |
Brandon C. Marin, Sai Vadlamani, Tolga Acikalin |
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| 12272650 |
Microelectronic package with substrate cavity for bridge-attach |
Debendra Mallik, Nitin A. Deshpande, Amruthavalli Pallavi Alur |
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| 12243792 |
Microelectronic structures including bridges |
Xiaoxuan Sun, Nitin A. Deshpande, Sairam Agraharam |
2025-03-04 |