Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12387999 | Planar integrated circuit package interconnects | Robert L. Sankman | 2025-08-12 |
| 12368089 | Low cost embedded integrated circuit dies | Xavier Francois Brun | 2025-07-22 |
| 12347782 | Microelectronic assemblies with direct attach to circuit boards | William J. Lambert, Bharat P. Penmecha, Xavier Francois Brun | 2025-07-01 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sri Chaitra Jyotsna Chavali, Robert L. Sankman, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12261124 | Embedded die architecture and method of making | Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2025-03-25 |