Home › 2025 › Intel › Robert M. Nickerson

RN

Robert M. Nickerson — 8 Patents in 2025

Intel: 8 patents #196 of 3,896Top 6%

Chandler, AZ: #27 of 487 inventorsTop 6%

Arizona: #92 of 3,383 inventorsTop 3%

Overall (2025): #11,269 of 469,880Top 3%

8 Patents 2025

Issued Patents 2025

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date
12476174	Ultra-thin, hyper-density semiconductor packages	Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more	2025-11-18
12417958	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-09-16
12406906	Through mold interconnect drill feature	Rees WINTERS, Purushotham Kaushik Muthur Srinath	2025-09-02
12406914	Ultra-thin, hyper-density semiconductor packages	Debendra Mallik, Robert L. Sankman, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more	2025-09-02
12394773	Laser ablation-based surface property modification and contamination removal	Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale	2025-08-19
12362340	Laser ablation-based surface property modification and contamination removal	Denis Myasishchev, Andrew V. Mazur, Purushotham Kaushik Muthur Srinath, Shripad Gokhale	2025-07-15
12347743	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-07-01
12315777	Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-05-27