Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-09-16 |
| 12406906 | Through mold interconnect drill feature | Robert M. Nickerson, Rees WINTERS | 2025-09-02 |
| 12394773 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Robert M. Nickerson, Shripad Gokhale | 2025-08-19 |
| 12362340 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Robert M. Nickerson, Shripad Gokhale | 2025-07-15 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-05-27 |