| 12406914 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2025-09-02 |
| 12387999 |
Planar integrated circuit package interconnects |
Sanka Ganesan |
2025-08-12 |
| 12341080 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon |
2025-06-24 |
| 12341129 |
Substrateless double-sided embedded multi-die interconnect bridge |
Biancun Xie, Jianyong Xie, Sujit Sharan, Debendra Mallik |
2025-06-24 |
| 12334242 |
Coreless electronic substrates having embedded inductors |
Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Anne Augustine, Kaladhar Radhakrishnan |
2025-06-17 |
| 12300620 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik |
2025-05-13 |
| 12272656 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-04-08 |
| 12261124 |
Embedded die architecture and method of making |
Sanka Ganesan, Sri Chaitra Jyotsna Chavali |
2025-03-25 |
| 12199048 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2025-01-14 |
| 12199085 |
Multi-chip packaging |
Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more |
2025-01-14 |