Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2025-09-02 |
| 12387999 | Planar integrated circuit package interconnects | Sanka Ganesan | 2025-08-12 |
| 12341080 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon | 2025-06-24 |
| 12341129 | Substrateless double-sided embedded multi-die interconnect bridge | Biancun Xie, Jianyong Xie, Sujit Sharan, Debendra Mallik | 2025-06-24 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Sri Chaitra Jyotsna Chavali, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12300620 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik | 2025-05-13 |
| 12272656 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-04-08 |
| 12261124 | Embedded die architecture and method of making | Sanka Ganesan, Sri Chaitra Jyotsna Chavali | 2025-03-25 |
| 12199048 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2025-01-14 |
| 12199085 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2025-01-14 |