Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334472 | Multiple wafer stack architecture to enable singulation | Omkar G. Karhade | 2025-06-17 |
| 12243792 | Microelectronic structures including bridges | Omkar G. Karhade, Xiaoxuan Sun, Nitin A. Deshpande | 2025-03-04 |
| 12199085 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2025-01-14 |