Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Robert L. Sankman, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12261124 | Embedded die architecture and method of making | Sanka Ganesan, Robert L. Sankman | 2025-03-25 |