Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327773 | Package with underfill containment barrier | Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew J. Brown +2 more | 2025-04-29 |
| 12224253 | Magnetic inductor device and method | Xin Ning, Brandon C. Marin, Siddharth K. Alur, Numair Ahmed, Brent Williams +3 more | 2025-02-11 |
| 12224264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Rahul Jain, Ji-Yong Park | 2025-02-11 |