Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Andrew J. Brown +2 more | 2025-04-29 |