Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288744 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Ji-Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng +2 more | 2025-04-29 |
| 12246532 | Vacuum aperture valve array | Anderson McKeague | 2025-03-11 |