Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Tarek A. Ibrahim, Rahul Jain, Haobo Chen | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12224253 | Magnetic inductor device and method | Xin Ning, Brandon C. Marin, Kyu Oh Lee, Numair Ahmed, Brent Williams +3 more | 2025-02-11 |